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CSP BUMP
CSP BUMP is a well-designed CSP solder ball inspection system that integrates precise mechanical design and advanced 2D/3D measurement technology. It is assembled and produced under strict control standards to meet the precise measurement needs of CSP dense solder balls, including upper circle diameter, height, coplanarity, etc. It can also perform chipping and deformation, ball drop, solder ball too large, solder ball too small, foreign matter, solder bridge, scratches, etc. It is the preferred measurement equipment for CSP solder balls.
