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Wafer AVI
It features deep integration of optical acquisition, advanced image processing algorithms, and AI-driven deep learning technologies. The core objective is to supersede conventional manual visual inspection which is characterized by high labor costs and fatigue-induced errors—thereby providing the industry with a high-quality, cost-effective, and high-throughput fully automated inspection solution.
In terms of technical performance, the system utilizes high-resolution line-scan imaging technology. This allows the system to achieve a precise equilibrium between inspection throughput and metrological accuracy during high-speed scanning. This system is primarily deployed for final visual inspection post-wafer dicing or prior to packaging. It is particularly well-suited for mid-to-late stage inspection in advanced packaging processes such as FOWLP and CoWoS, ensuring that every die adheres to stringent quality standards before proceeding to the next process node.